Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS

Abstract

In this paper, we propose structures for noise- coupling reduction between adjacent packages and dense multichip modules (MCMs), which are classified as (i) grounded-moating and (ii) shielding structures, and (iii) a combination of them. Good agreeement from a 3D finite-element method (3D-FEM) electromagnetic characterization and experimental verification of each structure are presented. (c) 2005 Wiley Periodicals, Inc.