DC Field | Value | Language |
---|---|---|
dc.contributor.author | Pak, J.S. | ko |
dc.contributor.author | Kim, J. | ko |
dc.contributor.author | Lee, H. | ko |
dc.contributor.author | Byun, J.-G. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-03-24T05:20:44Z | - |
dc.date.available | 2010-03-24T05:20:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-08-18 | - |
dc.identifier.citation | 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235 | - |
dc.identifier.issn | 0190-1494 | - |
dc.identifier.uri | http://hdl.handle.net/10203/17303 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB | - |
dc.type | Conference | - |
dc.identifier.wosid | 000185677200045 | - |
dc.identifier.scopusid | 2-s2.0-0141940095 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 231 | - |
dc.citation.endingpage | 235 | - |
dc.citation.publicationname | 2003 IEEE Symposium on Electromagnetic Compatibility | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Boston, MA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Pak, J.S. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
dc.contributor.nonIdAuthor | Lee, H. | - |
dc.contributor.nonIdAuthor | Byun, J.-G. | - |
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