DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Seung Seob | - |
dc.contributor.author | Kim, Sun-Rak | - |
dc.contributor.author | Lee, Jae Hak | - |
dc.date.accessioned | 2013-03-29T14:29:06Z | - |
dc.date.available | 2013-03-29T14:29:06Z | - |
dc.date.created | 2012-10-30 | - |
dc.date.issued | 2012-05 | - |
dc.identifier.citation | International Welding/Joining Conference, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/171389 | - |
dc.language | ENG | - |
dc.publisher | The Korean Welding and Joing Society | - |
dc.title | An efficient edge traces technique for stack chip interconnection | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Welding/Joining Conference | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Seung Seob | - |
dc.contributor.nonIdAuthor | Kim, Sun-Rak | - |
dc.contributor.nonIdAuthor | Lee, Jae Hak | - |
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