Analysis of Defective Patterns on Wafers in Semiconductor Manufacturing: A Bibliographical Review
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yum, Bong-Jin | ko |
| dc.contributor.author | Koo, Jaehoon | ko |
| dc.contributor.author | Kim, Seong-Jun | ko |
| dc.date.accessioned | 2013-03-29T14:14:28Z | - |
| dc.date.available | 2013-03-29T14:14:28Z | - |
| dc.date.created | 2012-08-30 | - |
| dc.date.created | 2012-08-30 | - |
| dc.date.issued | 2012-08-21 | - |
| dc.identifier.citation | 2012 IEEE International Conference on Automation Science and Engineering (CASE), pp.86 - 90 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/171296 | - |
| dc.description.abstract | The existing works on automatic detection and/or classification of clusters of defective dies on wafers is reviewed. The literature is classified into three major categories, namely, spatial randomness test, automatic cluster detection only, and automatic detection and classification of clusters. Future research directions are also discussed. | - |
| dc.language | English | - |
| dc.publisher | IEEE Robotics and Automation Society | - |
| dc.title | Analysis of Defective Patterns on Wafers in Semiconductor Manufacturing: A Bibliographical Review | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-84872586845 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 86 | - |
| dc.citation.endingpage | 90 | - |
| dc.citation.publicationname | 2012 IEEE International Conference on Automation Science and Engineering (CASE) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Seoul | - |
| dc.contributor.localauthor | Yum, Bong-Jin | - |
| dc.contributor.nonIdAuthor | Koo, Jaehoon | - |
| dc.contributor.nonIdAuthor | Kim, Seong-Jun | - |
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