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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

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dc.contributor.authorSong, Eunseokko
dc.contributor.authorKoo, Kyoungchoulko
dc.contributor.authorKim, Myunghoiko
dc.contributor.authorPark, Jun Soko
dc.contributor.authorKim Jounghoko
dc.date.accessioned2013-03-29T13:14:11Z-
dc.date.available2013-03-29T13:14:11Z-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.issued2011-10-24-
dc.identifier.citation20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.urihttp://hdl.handle.net/10203/170940-
dc.languageEnglish-
dc.publisherEPEP 2011-
dc.titleDecoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs-
dc.typeConference-
dc.identifier.wosid000299429300053-
dc.identifier.scopusid2-s2.0-84855385277-
dc.type.rimsCONF-
dc.citation.publicationname20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorKim Joungho-
dc.contributor.nonIdAuthorSong, Eunseok-
dc.contributor.nonIdAuthorKoo, Kyoungchoul-
dc.contributor.nonIdAuthorKim, Myunghoi-
dc.contributor.nonIdAuthorPark, Jun So-
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EE-Conference Papers(학술회의논문)
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