High-Freuquency TSV Failure Analysis
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joohee | ko |
| dc.contributor.author | Cho, Jonghyun | ko |
| dc.contributor.author | Jung, Hyunsuk | ko |
| dc.contributor.author | Pak, Jun So | ko |
| dc.contributor.author | Yook, Jong-Min | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Kim, Jun Chul | ko |
| dc.date.accessioned | 2013-03-29T13:13:34Z | - |
| dc.date.available | 2013-03-29T13:13:34Z | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.issued | 2011-10-24 | - |
| dc.identifier.citation | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.uri | http://hdl.handle.net/10203/170937 | - |
| dc.language | English | - |
| dc.publisher | EPEP 2011 | - |
| dc.title | High-Freuquency TSV Failure Analysis | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000299429300055 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, Joohee | - |
| dc.contributor.nonIdAuthor | Cho, Jonghyun | - |
| dc.contributor.nonIdAuthor | Jung, Hyunsuk | - |
| dc.contributor.nonIdAuthor | Pak, Jun So | - |
| dc.contributor.nonIdAuthor | Yook, Jong-Min | - |
| dc.contributor.nonIdAuthor | Kim, Jun Chul | - |
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