PDN Analysis of TSV based Decoupling Capacitor Stacked Chip (DCSC) in 3D-ICs
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, E | ko |
| dc.contributor.author | Pak, Jun So | ko |
| dc.contributor.author | Kim Joungho | ko |
| dc.date.accessioned | 2013-03-29T12:33:42Z | - |
| dc.date.available | 2013-03-29T12:33:42Z | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.issued | 2011-09-01 | - |
| dc.identifier.citation | 2011 IEEE Electrical Design of Advanced Package & Systems Symposium | - |
| dc.identifier.uri | http://hdl.handle.net/10203/170732 | - |
| dc.language | English | - |
| dc.publisher | EDAPS 2011 | - |
| dc.title | PDN Analysis of TSV based Decoupling Capacitor Stacked Chip (DCSC) in 3D-ICs | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000397197900076 | - |
| dc.identifier.scopusid | 2-s2.0-84864231381 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2011 IEEE Electrical Design of Advanced Package & Systems Symposium | - |
| dc.identifier.conferencecountry | CC | - |
| dc.identifier.conferencelocation | Hangzhou, China | - |
| dc.contributor.localauthor | Kim Joungho | - |
| dc.contributor.nonIdAuthor | Song, E | - |
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