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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs

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dc.contributor.authorKim, myunghoi-
dc.contributor.authorKoo, Kyoungchoul-
dc.contributor.authorKong, Sunkyu-
dc.contributor.authorBae, Bumhee-
dc.contributor.authorLee, Sangrok-
dc.contributor.authorKim Joungho-
dc.date.accessioned2013-03-29T11:57:56Z-
dc.date.available2013-03-29T11:57:56Z-
dc.date.created2012-07-06-
dc.date.issued2011-05-17-
dc.identifier.citation2011 Asia-Pacific Symposium on Electromagnetic Compatibility, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/170531-
dc.languageENG-
dc.publisher2011 Asia-Pacific Symposium on Electromagnetic Compatibility-
dc.titleVertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2011 Asia-Pacific Symposium on Electromagnetic Compatibility-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorKim Joungho-
dc.contributor.nonIdAuthorKim, myunghoi-
dc.contributor.nonIdAuthorKoo, Kyoungchoul-
dc.contributor.nonIdAuthorKong, Sunkyu-
dc.contributor.nonIdAuthorBae, Bumhee-
dc.contributor.nonIdAuthorLee, Sangrok-
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EE-Conference Papers(학술회의논문)
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