TSV-based Decoupling Capacitor Schemes in 3D-IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, Eunseok | ko |
| dc.contributor.author | Pak, Jun So | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2013-03-29T11:12:46Z | - |
| dc.date.available | 2013-03-29T11:12:46Z | - |
| dc.date.created | 2012-07-11 | - |
| dc.date.created | 2012-07-11 | - |
| dc.date.created | 2012-07-11 | - |
| dc.date.issued | 2012-05-29 | - |
| dc.identifier.citation | 62nd Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/170325 | - |
| dc.language | English | - |
| dc.publisher | 62nd Electronic Components and Technology Conference (ECTC) | - |
| dc.title | TSV-based Decoupling Capacitor Schemes in 3D-IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000309162000212 | - |
| dc.identifier.scopusid | 2-s2.0-84866867367 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 62nd Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Song, Eunseok | - |
| dc.contributor.nonIdAuthor | Pak, Jun So | - |
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.