DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Manho | - |
dc.contributor.author | Cho, Jonghyun | - |
dc.contributor.author | Pak, Jun So | - |
dc.contributor.author | Lee, Hyungdong | - |
dc.contributor.author | Kim, Joungho | - |
dc.date.accessioned | 2013-03-29T11:12:23Z | - |
dc.date.available | 2013-03-29T11:12:23Z | - |
dc.date.created | 2012-07-11 | - |
dc.date.issued | 2012-05-29 | - |
dc.identifier.citation | 62nd Electronic Components and Technology Conference (ECTC), v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/170323 | - |
dc.language | ENG | - |
dc.publisher | 62nd Electronic Components and Technology Conference (ECTC) | - |
dc.title | Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 62nd Electronic Components and Technology Conference (ECTC) | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Pak, Jun So | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Lee, Manho | - |
dc.contributor.nonIdAuthor | Cho, Jonghyun | - |
dc.contributor.nonIdAuthor | Lee, Hyungdong | - |
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