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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

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dc.contributor.authorLee, Manho-
dc.contributor.authorCho, Jonghyun-
dc.contributor.authorPak, Jun So-
dc.contributor.authorLee, Hyungdong-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-29T11:12:23Z-
dc.date.available2013-03-29T11:12:23Z-
dc.date.created2012-07-11-
dc.date.issued2012-05-29-
dc.identifier.citation62nd Electronic Components and Technology Conference (ECTC), v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/170323-
dc.languageENG-
dc.publisher62nd Electronic Components and Technology Conference (ECTC)-
dc.titleThermal Effects on Through-Silicon-Via (TSV) Signal Integrity-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname62nd Electronic Components and Technology Conference (ECTC)-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPak, Jun So-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorLee, Manho-
dc.contributor.nonIdAuthorCho, Jonghyun-
dc.contributor.nonIdAuthorLee, Hyungdong-
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EE-Conference Papers(학술회의논문)
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