DC Field | Value | Language |
---|---|---|
dc.contributor.author | Pak, J.S. | ko |
dc.contributor.author | Ryu, C. | ko |
dc.contributor.author | Kim, J. | ko |
dc.contributor.author | Shim, Y. | ko |
dc.contributor.author | Kim, G. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-03-08T06:07:37Z | - |
dc.date.available | 2010-03-08T06:07:37Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-19 | - |
dc.identifier.citation | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354 | - |
dc.identifier.uri | http://hdl.handle.net/10203/17008 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias | - |
dc.type | Conference | - |
dc.identifier.wosid | 000258515300089 | - |
dc.identifier.scopusid | 2-s2.0-51749083076 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 351 | - |
dc.citation.endingpage | 354 | - |
dc.citation.publicationname | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | - |
dc.identifier.conferencecountry | SI | - |
dc.identifier.conferencelocation | Suntec | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Pak, J.S. | - |
dc.contributor.nonIdAuthor | Ryu, C. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
dc.contributor.nonIdAuthor | Shim, Y. | - |
dc.contributor.nonIdAuthor | Kim, G. | - |
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