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A Vapor-Phase Deposited Polymer Film to Improve the Adhesion of Electroless-Deposited Copper Layer onto Various Kinds of Substrates You, Jae Bem; Kim, Shin Young; Park, Yong Jin; Ko, Young Gwan; Im, SungGap, LANGMUIR, v.30, no.3, pp.916 - 921, 2014-01 |
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