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Showing results 1 to 6 of 6

1
A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress

Park, Yong Cheon; Kim, Taehyun; Shim, Hye Rin; Choi, YoungWoo; Hong, Seungbum; Yoo, Seunghyup; Im, Sung Gap, APPLIED SURFACE SCIENCE, v.598, 2022-10

2
A Solvent-Free, Thermally Curable Low-Temperature Organic Planarization Layer for Thin Film Encapsulation

Park, Yong Cheon; Shim, Hye Rin; Jeong, Kihoon; Im, Sung Gap, SMALL, v.19, no.10, 2023-03

3
(A) thin barrier adhesive fabricated via initiated chemical vapor deposition for laminated encapsulation = 개시제를 이용한 화학기상증착 공정을 통해 합성된 적층 봉지용 박막 접착제 연구link

Park, Yong Cheon; Im, Sung Gap; et al, 한국과학기술원, 2019

4
Development of flexible encapsulation and planarization layer via vapor phase deposition = 기상 증착 공정을 활용한 유연 봉지 및 이를 위한 평탄층 개발link

Park, Yong Cheon; Im, Sung Gap; et al, 한국과학기술원, 2023

5
Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles

Jeong, So Yeong; Shim, Hye Rin; Na, Yunha; Kang, Ki Suk; Jeon, Yongmin; Choi, Seungyeop; Jeong, Eun Gyo; et al, NPJ FLEXIBLE ELECTRONICS, v.5, no.1, pp.15, 2021-07

6
High-performance thin H:SiON OLED encapsulation layer deposited by PECVD at low temperature

Park, Kyoung Woo; Lee, Seunghee; Lee, Hyunkoo; Cho, Yong-Hwan; Park, Yong Cheon; Im, Sung Gap; Park, Sang-Hee Ko, RSC ADVANCES, v.9, no.1, pp.58 - 64, 2019-01

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