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Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects![]() Yoo, Hocheon; Park, Hongkeun; Yoo, Seunghyun; On, Sungmin; Seong, Hyejeong; Im, Sung Gap; Kim, Jae-Joon, NATURE COMMUNICATIONS, v.10, no.1, pp.2424, 2019-06 |
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