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Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects![]() Yoo, Hocheon; Park, Hongkeun; Yoo, Seunghyun; On, Sungmin; Seong, Hyejeong; Im, Sung Gap; Kim, Jae-Joon, NATURE COMMUNICATIONS, v.10, no.1, pp.2424, 2019-06 |
Multi-Stage Organic Logic Circuits Using Via-Hole-Less Metal Interconnects Park, Hongkeun; Yoo, Hocheon; Lee, Chungryeol; Kim, Jae-Joon; Im, Sung Gap, IEEE ELECTRON DEVICE LETTERS, v.41, no.11, pp.1685 - 1687, 2020-11 |
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