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A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures Jeong, Kihoon; Kim, Dohun; AHN, DAHYE; Yang, Chanhee; Kim, Junmo; Lee, ChangHyeon; Kim, Youson; et al, CHEMICAL ENGINEERING JOURNAL, v.480, 2024-01 |
Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
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