Reliability Assessment of Electronic Packaging and Thin Film
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee Soon-Bok | - |
| dc.date.accessioned | 2013-03-29T09:37:01Z | - |
| dc.date.available | 2013-03-29T09:37:01Z | - |
| dc.date.created | 2012-07-04 | - |
| dc.date.issued | 2011-11 | - |
| dc.identifier.citation | ICMR2011(International Conference on Materials Reliability 2011), v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169811 | - |
| dc.language | ENG | - |
| dc.publisher | KSME | - |
| dc.title | Reliability Assessment of Electronic Packaging and Thin Film | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | ICMR2011(International Conference on Materials Reliability 2011) | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee Soon-Bok | - |
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