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Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation

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Pak, J.S. / Ryu, C. / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2007-11-19
Language
English
Citation

International Conference on Electronic Materials and Packaging, EMAP 2007

URI
http://hdl.handle.net/10203/16975
Appears in Collection
EE-Conference Papers(학술회의논문)
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