DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Jang, Jae-Won | - |
dc.date.accessioned | 2013-03-29T08:34:13Z | - |
dc.date.available | 2013-03-29T08:34:13Z | - |
dc.date.created | 2012-07-04 | - |
dc.date.issued | 2011-12 | - |
dc.identifier.citation | EMAP2011, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/169438 | - |
dc.language | ENG | - |
dc.title | An Advanced Thermal Cycling Test for Reliability Assessment of a Stack Package | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | EMAP2011 | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Jang, Jae-Won | - |
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