Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Shin, Ji-Won | ko |
| dc.contributor.author | Choi, Yong-Won | ko |
| dc.contributor.author | Kim, Young Soon | ko |
| dc.contributor.author | Kang, Un Byung | ko |
| dc.contributor.author | Jee, Young Kun | ko |
| dc.contributor.author | Hwang, Ji Hwan | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-29T07:55:20Z | - |
| dc.date.available | 2013-03-29T07:55:20Z | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.issued | 2012-05 | - |
| dc.identifier.citation | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169200 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000309162000006 | - |
| dc.identifier.scopusid | 2-s2.0-84866851151 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Shin, Ji-Won | - |
| dc.contributor.nonIdAuthor | Choi, Yong-Won | - |
| dc.contributor.nonIdAuthor | Kim, Young Soon | - |
| dc.contributor.nonIdAuthor | Kang, Un Byung | - |
| dc.contributor.nonIdAuthor | Jee, Young Kun | - |
| dc.contributor.nonIdAuthor | Hwang, Ji Hwan | - |
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