Nanofiber Incorporated Anisotropic Conductive Adhesives (ACAs) for Fine Pitch Electronic Packaging Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Suk, Kyoung-Lim | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-29T07:38:53Z | - |
| dc.date.available | 2013-03-29T07:38:53Z | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.issued | 2012-05 | - |
| dc.identifier.citation | Electrospin 2012, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169096 | - |
| dc.language | ENG | - |
| dc.title | Nanofiber Incorporated Anisotropic Conductive Adhesives (ACAs) for Fine Pitch Electronic Packaging Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Electrospin 2012 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Suk, Kyoung-Lim | - |
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