Top-down, bottom-up, and hybrid nanofabrication for multifunctional nanowire electronics applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Inkyu | - |
| dc.date.accessioned | 2013-03-29T07:09:15Z | - |
| dc.date.available | 2013-03-29T07:09:15Z | - |
| dc.date.created | 2012-06-01 | - |
| dc.date.issued | 2011-06-04 | - |
| dc.identifier.citation | The 3rd International Symposium on Microchemistry and Microsystems (ISMM), v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/168923 | - |
| dc.language | ENG | - |
| dc.publisher | Korean BioChip Society | - |
| dc.title | Top-down, bottom-up, and hybrid nanofabrication for multifunctional nanowire electronics applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 3rd International Symposium on Microchemistry and Microsystems (ISMM) | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Park, Inkyu | - |
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