Compact thermal models: assessment and pitfalls
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jung, J | ko |
| dc.contributor.author | Shin, Youngsoo | ko |
| dc.date.accessioned | 2013-03-29T07:03:42Z | - |
| dc.date.available | 2013-03-29T07:03:42Z | - |
| dc.date.created | 2012-06-01 | - |
| dc.date.created | 2012-06-01 | - |
| dc.date.issued | 2011-11-18 | - |
| dc.identifier.citation | 2011 International SoC Design Conference (ISOCC), pp.337 - 340 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/168890 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Compact thermal models: assessment and pitfalls | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-84857418786 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 337 | - |
| dc.citation.endingpage | 340 | - |
| dc.citation.publicationname | 2011 International SoC Design Conference (ISOCC) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Jeju | - |
| dc.contributor.localauthor | Shin, Youngsoo | - |
| dc.contributor.nonIdAuthor | Jung, J | - |
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