DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Jae-Won | - |
dc.contributor.author | Suk, Kyoung-Lim | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.date.accessioned | 2013-03-28T13:52:09Z | - |
dc.date.available | 2013-03-28T13:52:09Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-11 | - |
dc.identifier.citation | Int conf. on Computer-aided Manufacturing and Design, CMD2010, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/166279 | - |
dc.language | ENG | - |
dc.title | Warpage behavior of chip-on-flex(COF) package under thermal cycling condition | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | Int conf. on Computer-aided Manufacturing and Design, CMD2010 | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.identifier.conferencecountry | Hong Kong | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Jang, Jae-Won | - |
dc.contributor.nonIdAuthor | Suk, Kyoung-Lim | - |
dc.contributor.nonIdAuthor | Paik, Kyung-Wook | - |
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