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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Development of inclined conductive bump (ICB) for flip-chip interconnection

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dc.contributor.authorPark A.-Y.ko
dc.contributor.authorKim S.-R.ko
dc.contributor.authorYoo C.D.ko
dc.contributor.authorKim, Taek-Sooko
dc.date.accessioned2013-03-28T12:54:53Z-
dc.date.available2013-03-28T12:54:53Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-05-31-
dc.identifier.citation2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/165889-
dc.languageEnglish-
dc.publisherECTC-
dc.titleDevelopment of inclined conductive bump (ICB) for flip-chip interconnection-
dc.typeConference-
dc.identifier.wosid000302341400133-
dc.identifier.scopusid2-s2.0-79960410643-
dc.type.rimsCONF-
dc.citation.beginningpage880-
dc.citation.endingpage885-
dc.citation.publicationname2011 61st Electronic Components and Technology Conference, ECTC 2011-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLake Buena Vista, FL-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.nonIdAuthorPark A.-Y.-
dc.contributor.nonIdAuthorKim S.-R.-
dc.contributor.nonIdAuthorYoo C.D.-
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ME-Conference Papers(학술회의논문)
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