DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park A.-Y. | ko |
dc.contributor.author | Kim S.-R. | ko |
dc.contributor.author | Yoo C.D. | ko |
dc.contributor.author | Kim, Taek-Soo | ko |
dc.date.accessioned | 2013-03-28T12:54:53Z | - |
dc.date.available | 2013-03-28T12:54:53Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-05-31 | - |
dc.identifier.citation | 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/165889 | - |
dc.language | English | - |
dc.publisher | ECTC | - |
dc.title | Development of inclined conductive bump (ICB) for flip-chip interconnection | - |
dc.type | Conference | - |
dc.identifier.wosid | 000302341400133 | - |
dc.identifier.scopusid | 2-s2.0-79960410643 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 880 | - |
dc.citation.endingpage | 885 | - |
dc.citation.publicationname | 2011 61st Electronic Components and Technology Conference, ECTC 2011 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Lake Buena Vista, FL | - |
dc.contributor.localauthor | Kim, Taek-Soo | - |
dc.contributor.nonIdAuthor | Park A.-Y. | - |
dc.contributor.nonIdAuthor | Kim S.-R. | - |
dc.contributor.nonIdAuthor | Yoo C.D. | - |
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