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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

An efficient edge traces technique for 3D interconnection of stack chip

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dc.contributor.authorKim, SR-
dc.contributor.authorPark, AY-
dc.contributor.authorYoo, CD-
dc.contributor.authorLee, JH-
dc.contributor.authorSong, JY-
dc.contributor.authorLee, Seung Seob-
dc.date.accessioned2013-03-28T12:19:42Z-
dc.date.available2013-03-28T12:19:42Z-
dc.date.created2012-02-06-
dc.date.issued2011-05-31-
dc.identifier.citation2011 61st Electronic Components and Technology Conference, ECTC 2011, v., no., pp.1878 - 1882-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/165652-
dc.languageENG-
dc.titleAn efficient edge traces technique for 3D interconnection of stack chip-
dc.typeConference-
dc.identifier.scopusid2-s2.0-79960431651-
dc.type.rimsCONF-
dc.citation.beginningpage1878-
dc.citation.endingpage1882-
dc.citation.publicationname2011 61st Electronic Components and Technology Conference, ECTC 2011-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Seung Seob-
dc.contributor.nonIdAuthorKim, SR-
dc.contributor.nonIdAuthorPark, AY-
dc.contributor.nonIdAuthorYoo, CD-
dc.contributor.nonIdAuthorLee, JH-
dc.contributor.nonIdAuthorSong, JY-
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ME-Conference Papers(학술회의논문)
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