DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, SR | - |
dc.contributor.author | Park, AY | - |
dc.contributor.author | Yoo, CD | - |
dc.contributor.author | Lee, JH | - |
dc.contributor.author | Song, JY | - |
dc.contributor.author | Lee, Seung Seob | - |
dc.date.accessioned | 2013-03-28T12:19:42Z | - |
dc.date.available | 2013-03-28T12:19:42Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-05-31 | - |
dc.identifier.citation | 2011 61st Electronic Components and Technology Conference, ECTC 2011, v., no., pp.1878 - 1882 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/165652 | - |
dc.language | ENG | - |
dc.title | An efficient edge traces technique for 3D interconnection of stack chip | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-79960431651 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1878 | - |
dc.citation.endingpage | 1882 | - |
dc.citation.publicationname | 2011 61st Electronic Components and Technology Conference, ECTC 2011 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Seung Seob | - |
dc.contributor.nonIdAuthor | Kim, SR | - |
dc.contributor.nonIdAuthor | Park, AY | - |
dc.contributor.nonIdAuthor | Yoo, CD | - |
dc.contributor.nonIdAuthor | Lee, JH | - |
dc.contributor.nonIdAuthor | Song, JY | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.