DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hong, Soon-Hyung | - |
dc.date.accessioned | 2013-03-28T12:12:44Z | - |
dc.date.available | 2013-03-28T12:12:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-08-17 | - |
dc.identifier.citation | NANO KOREA 2010, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/165596 | - |
dc.language | ENG | - |
dc.title | Relationship between interface and peel strength of Cu-Ni clads prepared by surface activated bonding | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | NANO KOREA 2010 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Hong, Soon-Hyung | - |
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