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College of Engineering(공과대학)Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)NE-Conference Papers(학술회의논문)

TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections

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dc.contributor.authorPak, Jun So-
dc.contributor.authorCho J.-
dc.contributor.authorKim J.-
dc.contributor.authorLee J.-
dc.contributor.authorLee H.-
dc.contributor.authorPark K.-
dc.contributor.authorKim J.-
dc.date.accessioned2013-03-28T11:38:09Z-
dc.date.available2013-03-28T11:38:09Z-
dc.date.created2012-02-06-
dc.date.issued2010-08-24-
dc.identifier.citation2010 IEEE CPMT Symposium Japan, ICSJ10, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/165368-
dc.languageENG-
dc.titleTSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections-
dc.typeConference-
dc.identifier.scopusid2-s2.0-79251542106-
dc.type.rimsCONF-
dc.citation.publicationname2010 IEEE CPMT Symposium Japan, ICSJ10-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorPak, Jun So-
dc.contributor.nonIdAuthorCho J.-
dc.contributor.nonIdAuthorKim J.-
dc.contributor.nonIdAuthorLee J.-
dc.contributor.nonIdAuthorLee H.-
dc.contributor.nonIdAuthorPark K.-
dc.contributor.nonIdAuthorKim J.-
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NE-Conference Papers(학술회의논문)
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