DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Han, SH | ko |
dc.date.accessioned | 2013-03-28T10:39:23Z | - |
dc.date.available | 2013-03-28T10:39:23Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-08-02 | - |
dc.identifier.citation | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, pp.2755 - 2758 | - |
dc.identifier.issn | 0255-5476 | - |
dc.identifier.uri | http://hdl.handle.net/10203/164949 | - |
dc.language | English | - |
dc.publisher | Materials Australia | - |
dc.title | A study on B-stage CNT/epoxy composite films for electronic packaging applications | - |
dc.type | Conference | - |
dc.identifier.wosid | 000285374600676 | - |
dc.identifier.scopusid | 2-s2.0-77955499587 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 2755 | - |
dc.citation.endingpage | 2758 | - |
dc.citation.publicationname | 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 | - |
dc.identifier.conferencecountry | AT | - |
dc.identifier.conferencelocation | Cairns, QLD | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Han, SH | - |
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