The effects of heat treatment on the bonding strength of surface-activated bonding (SAB)-treated copper-nickel fine clad metals

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dc.contributor.authorKim K.H.-
dc.contributor.authorLim S.C.-
dc.contributor.authorKwon H.C.-
dc.date.accessioned2013-03-28T10:38:05Z-
dc.date.available2013-03-28T10:38:05Z-
dc.date.created2012-02-06-
dc.date.issued2010-08-02-
dc.identifier.citation7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, v., no., pp.1932 - 1935-
dc.identifier.issn0255-5476-
dc.identifier.urihttp://hdl.handle.net/10203/164942-
dc.languageENG-
dc.titleThe effects of heat treatment on the bonding strength of surface-activated bonding (SAB)-treated copper-nickel fine clad metals-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77955475537-
dc.type.rimsCONF-
dc.citation.beginningpage1932-
dc.citation.endingpage1935-
dc.citation.publicationname7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7-
dc.identifier.conferencecountryAustralia-
dc.identifier.conferencecountryAustralia-
dc.contributor.localauthorKim K.H.-
dc.contributor.nonIdAuthorLim S.C.-
dc.contributor.nonIdAuthorKwon H.C.-
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