High power and fine pitch assembly using solder anisotropic conductive films (ACFs) combined with ultrasonic bonding technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, K | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-28T10:37:54Z | - |
| dc.date.available | 2013-03-28T10:37:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2010-06-01 | - |
| dc.identifier.citation | 60th Electronic Components and Technology Conference, ECTC 2010, pp.421 - 426 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164941 | - |
| dc.language | English | - |
| dc.publisher | ECTC | - |
| dc.title | High power and fine pitch assembly using solder anisotropic conductive films (ACFs) combined with ultrasonic bonding technique | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000287024100064 | - |
| dc.identifier.scopusid | 2-s2.0-77955187197 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 421 | - |
| dc.citation.endingpage | 426 | - |
| dc.citation.publicationname | 60th Electronic Components and Technology Conference, ECTC 2010 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Las Vegas, NV | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Lee, K | - |
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