High power and fine pitch assembly using solder anisotropic conductive films (ACFs) combined with ultrasonic bonding technique

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Publisher
ECTC
Issue Date
2010-06-01
Language
ENG
Citation

60th Electronic Components and Technology Conference, ECTC 2010, pp.421 - 426

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164941
Appears in Collection
MS-Conference Papers(학술회의논문)
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