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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

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dc.contributor.authorSong, T-
dc.contributor.authorLiu, C-
dc.contributor.authorKim, DH-
dc.contributor.authorLim, SK-
dc.contributor.authorCho, J-
dc.contributor.authorKim, J-
dc.contributor.authorPak, JS-
dc.contributor.authorAhn, Seungyoung-
dc.contributor.authorKim, Joung Ho-
dc.contributor.authorYoon, K-
dc.date.accessioned2013-03-28T10:24:48Z-
dc.date.available2013-03-28T10:24:48Z-
dc.date.created2012-02-06-
dc.date.issued2011-03-14-
dc.identifier.citation12th International Symposium on Quality Electronic Design, ISQED 2011, v., no., pp.122 - 128-
dc.identifier.urihttp://hdl.handle.net/10203/164869-
dc.languageENG-
dc.publisherISQED 2011-
dc.titleAnalysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs-
dc.typeConference-
dc.identifier.scopusid2-s2.0-79959274550-
dc.type.rimsCONF-
dc.citation.beginningpage122-
dc.citation.endingpage128-
dc.citation.publicationname12th International Symposium on Quality Electronic Design, ISQED 2011-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorAhn, Seungyoung-
dc.contributor.localauthorKim, Joung Ho-
dc.contributor.nonIdAuthorSong, T-
dc.contributor.nonIdAuthorLiu, C-
dc.contributor.nonIdAuthorKim, DH-
dc.contributor.nonIdAuthorLim, SK-
dc.contributor.nonIdAuthorCho, J-
dc.contributor.nonIdAuthorKim, J-
dc.contributor.nonIdAuthorPak, JS-
dc.contributor.nonIdAuthorYoon, K-
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EE-Conference Papers(학술회의논문)
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