Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, T | ko |
| dc.contributor.author | Liu, C | ko |
| dc.contributor.author | Kim, DH | ko |
| dc.contributor.author | Lim, SK | ko |
| dc.contributor.author | Cho, J | ko |
| dc.contributor.author | Kim, J | ko |
| dc.contributor.author | Pak, JS | ko |
| dc.contributor.author | Ahn, Seungyoung | ko |
| dc.contributor.author | Kim, Joung Ho | ko |
| dc.contributor.author | Yoon, K | ko |
| dc.date.accessioned | 2013-03-28T10:24:48Z | - |
| dc.date.available | 2013-03-28T10:24:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-03-14 | - |
| dc.identifier.citation | 12th International Symposium on Quality Electronic Design, ISQED 2011, pp.122 - 128 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164869 | - |
| dc.language | English | - |
| dc.publisher | ISQED 2011 | - |
| dc.title | Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000299054300020 | - |
| dc.identifier.scopusid | 2-s2.0-79959274550 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 122 | - |
| dc.citation.endingpage | 128 | - |
| dc.citation.publicationname | 12th International Symposium on Quality Electronic Design, ISQED 2011 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Santa Clara, CA | - |
| dc.contributor.localauthor | Kim, Joung Ho | - |
| dc.contributor.nonIdAuthor | Song, T | - |
| dc.contributor.nonIdAuthor | Liu, C | - |
| dc.contributor.nonIdAuthor | Kim, DH | - |
| dc.contributor.nonIdAuthor | Lim, SK | - |
| dc.contributor.nonIdAuthor | Cho, J | - |
| dc.contributor.nonIdAuthor | Kim, J | - |
| dc.contributor.nonIdAuthor | Pak, JS | - |
| dc.contributor.nonIdAuthor | Yoon, K | - |
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