Analysis of power distribution network in TSV-based 3D-IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, K. | - |
| dc.contributor.author | Lee, W. | - |
| dc.contributor.author | Kim, J. | - |
| dc.contributor.author | Song, T. | - |
| dc.contributor.author | Kim, J. | - |
| dc.contributor.author | Pak, J.S. | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.contributor.author | Lee, H. | - |
| dc.contributor.author | Kwon, Y. | - |
| dc.contributor.author | Park, K. | - |
| dc.date.accessioned | 2013-03-28T10:16:02Z | - |
| dc.date.available | 2013-03-28T10:16:02Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2010-10-25 | - |
| dc.identifier.citation | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, v., no., pp.177 - 180 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164807 | - |
| dc.language | ENG | - |
| dc.publisher | IEEE | - |
| dc.title | Analysis of power distribution network in TSV-based 3D-IC | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-78650941127 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 177 | - |
| dc.citation.endingpage | 180 | - |
| dc.citation.publicationname | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, K. | - |
| dc.contributor.nonIdAuthor | Lee, W. | - |
| dc.contributor.nonIdAuthor | Kim, J. | - |
| dc.contributor.nonIdAuthor | Song, T. | - |
| dc.contributor.nonIdAuthor | Kim, J. | - |
| dc.contributor.nonIdAuthor | Pak, J.S. | - |
| dc.contributor.nonIdAuthor | Lee, H. | - |
| dc.contributor.nonIdAuthor | Kwon, Y. | - |
| dc.contributor.nonIdAuthor | Park, K. | - |
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