Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface

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Publisher
ECTC
Issue Date
2010-06-01
Language
ENG
Citation

60th Electronic Components and Technology Conference, ECTC 2010, pp.329 - 335

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164760
Appears in Collection
MS-Conference Papers(학술회의논문)
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