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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Through Silicon Via (TSV) shielding structures

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dc.contributor.authorCho, J.-
dc.contributor.authorKim, Joungho-
dc.contributor.authorSong, T.-
dc.contributor.authorPak, J.S.-
dc.contributor.authorKim, J.-
dc.contributor.authorLee, H.-
dc.contributor.authorLee, J.-
dc.contributor.authorPark K.-
dc.date.accessioned2013-03-28T10:06:07Z-
dc.date.available2013-03-28T10:06:07Z-
dc.date.created2012-02-06-
dc.date.issued2010-10-25-
dc.identifier.citation2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, v., no., pp.269 - 272-
dc.identifier.urihttp://hdl.handle.net/10203/164756-
dc.languageENG-
dc.publisherIEEE-
dc.titleThrough Silicon Via (TSV) shielding structures-
dc.typeConference-
dc.identifier.scopusid2-s2.0-78650960452-
dc.type.rimsCONF-
dc.citation.beginningpage269-
dc.citation.endingpage272-
dc.citation.publicationname2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorCho, J.-
dc.contributor.nonIdAuthorSong, T.-
dc.contributor.nonIdAuthorPak, J.S.-
dc.contributor.nonIdAuthorKim, J.-
dc.contributor.nonIdAuthorLee, H.-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorPark K.-
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EE-Conference Papers(학술회의논문)
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