A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Choi, Y | ko |
| dc.contributor.author | Shin, J | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-28T09:43:15Z | - |
| dc.date.available | 2013-03-28T09:43:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-05-31 | - |
| dc.identifier.citation | 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1126 - 1129 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164607 | - |
| dc.language | English | - |
| dc.publisher | ECTC | - |
| dc.title | A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000302341400169 | - |
| dc.identifier.scopusid | 2-s2.0-79960413183 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1126 | - |
| dc.citation.endingpage | 1129 | - |
| dc.citation.publicationname | 2011 61st Electronic Components and Technology Conference, ECTC 2011 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Lake Buena Vista, FL | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Choi, Y | - |
| dc.contributor.nonIdAuthor | Shin, J | - |
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