Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 281
  • Download : 0
Publisher
ECTC
Issue Date
2010-06-01
Language
ENG
Citation

60th Electronic Components and Technology Conference, ECTC 2010, pp.1436 - 1441

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164467
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0