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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

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dc.contributor.authorCho, J.-
dc.contributor.authorYoon, K.-
dc.contributor.authorPak, J.S.-
dc.contributor.authorKim, J.-
dc.contributor.authorLee, J.-
dc.contributor.authorLee, H.-
dc.contributor.authorPark, K.-
dc.contributor.authorKim, Joungho-
dc.date.accessioned2013-03-28T09:06:36Z-
dc.date.available2013-03-28T09:06:36Z-
dc.date.created2012-02-06-
dc.date.issued2010-08-24-
dc.identifier.citation2010 IEEE CPMT Symposium Japan, ICSJ10, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/164369-
dc.languageENG-
dc.publisherIEEE-
dc.titleGuard ring effect for Through Silicon Via (TSV) noise coupling reduction-
dc.typeConference-
dc.identifier.scopusid2-s2.0-79251534098-
dc.type.rimsCONF-
dc.citation.publicationname2010 IEEE CPMT Symposium Japan, ICSJ10-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorCho, J.-
dc.contributor.nonIdAuthorYoon, K.-
dc.contributor.nonIdAuthorPak, J.S.-
dc.contributor.nonIdAuthorKim, J.-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorLee, H.-
dc.contributor.nonIdAuthorPark, K.-
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EE-Conference Papers(학술회의논문)
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