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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation

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dc.contributor.authorKim Y.-J.-
dc.contributor.authorHan J.-H.-
dc.contributor.authorKim J.-W.-
dc.contributor.authorKwon, Young Se-
dc.date.accessioned2013-03-28T08:43:21Z-
dc.date.available2013-03-28T08:43:21Z-
dc.date.created2012-02-06-
dc.date.issued2010-06-01-
dc.identifier.citation60th Electronic Components and Technology Conference, ECTC 2010, v., no., pp.1664 - 1668-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/164235-
dc.languageENG-
dc.titleLow cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77955199018-
dc.type.rimsCONF-
dc.citation.beginningpage1664-
dc.citation.endingpage1668-
dc.citation.publicationname60th Electronic Components and Technology Conference, ECTC 2010-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKwon, Young Se-
dc.contributor.nonIdAuthorKim Y.-J.-
dc.contributor.nonIdAuthorHan J.-H.-
dc.contributor.nonIdAuthorKim J.-W.-
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EE-Conference Papers(학술회의논문)
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