DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim Y.-J. | - |
dc.contributor.author | Han J.-H. | - |
dc.contributor.author | Kim J.-W. | - |
dc.contributor.author | Kwon, Young Se | - |
dc.date.accessioned | 2013-03-28T08:43:21Z | - |
dc.date.available | 2013-03-28T08:43:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-06-01 | - |
dc.identifier.citation | 60th Electronic Components and Technology Conference, ECTC 2010, v., no., pp.1664 - 1668 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/164235 | - |
dc.language | ENG | - |
dc.title | Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-77955199018 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1664 | - |
dc.citation.endingpage | 1668 | - |
dc.citation.publicationname | 60th Electronic Components and Technology Conference, ECTC 2010 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kwon, Young Se | - |
dc.contributor.nonIdAuthor | Kim Y.-J. | - |
dc.contributor.nonIdAuthor | Han J.-H. | - |
dc.contributor.nonIdAuthor | Kim J.-W. | - |
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