DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee J.H. | - |
dc.contributor.author | Ha T.H. | - |
dc.contributor.author | Lee C.W. | - |
dc.contributor.author | Song J.-Y. | - |
dc.contributor.author | Yoo C.D. | - |
dc.date.accessioned | 2013-03-28T08:38:47Z | - |
dc.date.available | 2013-03-28T08:38:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-09-13 | - |
dc.identifier.citation | 3rd Electronics System Integration Technology Conference, ESTC 2010, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/164210 | - |
dc.language | ENG | - |
dc.title | Low temperature hybrid bonding using self-alignment | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-78651312468 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 3rd Electronics System Integration Technology Conference, ESTC 2010 | - |
dc.identifier.conferencecountry | Germany | - |
dc.identifier.conferencecountry | Germany | - |
dc.contributor.localauthor | Yoo C.D. | - |
dc.contributor.nonIdAuthor | Lee J.H. | - |
dc.contributor.nonIdAuthor | Ha T.H. | - |
dc.contributor.nonIdAuthor | Lee C.W. | - |
dc.contributor.nonIdAuthor | Song J.-Y. | - |
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