DC Field | Value | Language |
---|---|---|
dc.contributor.author | Pak, Jun So | ko |
dc.contributor.author | Cho, J. | ko |
dc.contributor.author | Kim, J. | ko |
dc.contributor.author | Lee, J. | ko |
dc.contributor.author | Lee, H. | ko |
dc.contributor.author | Park, K. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2013-03-28T07:58:19Z | - |
dc.date.available | 2013-03-28T07:58:19Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-06-01 | - |
dc.identifier.citation | 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/163966 | - |
dc.language | English | - |
dc.publisher | ECTC 2010 | - |
dc.title | Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package | - |
dc.type | Conference | - |
dc.identifier.wosid | 000287024100105 | - |
dc.identifier.scopusid | 2-s2.0-77955201755 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 667 | - |
dc.citation.endingpage | 672 | - |
dc.citation.publicationname | 60th Electronic Components and Technology Conference, ECTC 2010 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Las Vegas, NV | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Cho, J. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
dc.contributor.nonIdAuthor | Lee, J. | - |
dc.contributor.nonIdAuthor | Lee, H. | - |
dc.contributor.nonIdAuthor | Park, K. | - |
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