Hybrid microdisk laser on a silicon platform using lateral-field optoelectronic tweezers assembly

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An InGaAs/InGaAsP microdisk laser is assembled on silicon using lateral-field optoelectronic tweezers, achieving room-temperature pulsed operation with a threshold power of 0.85 mW. The room-temperature assembly enables a post-CMOS process to fabricate micro-lasers on silicon.
Publisher
CLEO/QELS 2008. Conference on
Issue Date
2008-05-04
Language
English
Citation

Lasers and Electro-Optics, 2008 and 2008 Conference on Quantum Electronics and Laser Science. , pp.1 - 2

URI
http://hdl.handle.net/10203/162600
Appears in Collection
EE-Conference Papers(학술회의논문)

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