DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hyuck Mo | - |
dc.date.accessioned | 2013-03-28T03:29:03Z | - |
dc.date.available | 2013-03-28T03:29:03Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-05-17 | - |
dc.identifier.citation | 38th CALPHAD, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/162565 | - |
dc.language | ENG | - |
dc.title | Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 38th CALPHAD | - |
dc.identifier.conferencecountry | Czech Republic | - |
dc.identifier.conferencecountry | Czech Republic | - |
dc.contributor.localauthor | Lee, Hyuck Mo | - |
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