Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded Packaging)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim K.-M. | ko |
| dc.contributor.author | Yook J.-M. | ko |
| dc.contributor.author | Yeo S.-K. | ko |
| dc.contributor.author | Kwon, Young Se | ko |
| dc.date.accessioned | 2013-03-27T09:54:46Z | - |
| dc.date.available | 2013-03-27T09:54:46Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-10-08 | - |
| dc.identifier.citation | European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, pp.327 - 330 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/161437 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded Packaging) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000255921400287 | - |
| dc.identifier.scopusid | 2-s2.0-48149114886 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 327 | - |
| dc.citation.endingpage | 330 | - |
| dc.citation.publicationname | European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007 | - |
| dc.identifier.conferencecountry | GE | - |
| dc.identifier.conferencelocation | Munich | - |
| dc.contributor.localauthor | Kwon, Young Se | - |
| dc.contributor.nonIdAuthor | Kim K.-M. | - |
| dc.contributor.nonIdAuthor | Yook J.-M. | - |
| dc.contributor.nonIdAuthor | Yeo S.-K. | - |
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