Removing Temperature Effects from Impedance-based Damage Detection Technique Using Principal Component Analysis

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dc.contributor.authorYun, Chung Bang-
dc.contributor.authorKoo, Ki Young-
dc.contributor.authorPark, Seunghee-
dc.contributor.authorLee, Jong-Jae-
dc.date.accessioned2013-03-27T08:01:24Z-
dc.date.available2013-03-27T08:01:24Z-
dc.date.created2012-02-06-
dc.date.issued2008-02-
dc.identifier.citationProceedings of IMAC XXVI Conference & Exposition, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/160629-
dc.languageENG-
dc.titleRemoving Temperature Effects from Impedance-based Damage Detection Technique Using Principal Component Analysis-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameProceedings of IMAC XXVI Conference & Exposition-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYun, Chung Bang-
dc.contributor.nonIdAuthorKoo, Ki Young-
dc.contributor.nonIdAuthorPark, Seunghee-
dc.contributor.nonIdAuthorLee, Jong-Jae-
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CE-Conference Papers(학술회의논문)
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