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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorSon, HY-
dc.contributor.authorKim, I-
dc.contributor.authorPark, JH-
dc.contributor.authorJung, GJ-
dc.contributor.authorPark, BJ-
dc.contributor.authorByun, KY-
dc.contributor.authorPaik, KW-
dc.date.accessioned2013-03-27T06:57:51Z-
dc.date.available2013-03-27T06:57:51Z-
dc.date.created2012-02-06-
dc.date.issued2008-
dc.identifier.citationEPTC 2008, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/160164-
dc.languageENG-
dc.titleThermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameEPTC 2008-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorKim, I-
dc.contributor.nonIdAuthorPark, JH-
dc.contributor.nonIdAuthorJung, GJ-
dc.contributor.nonIdAuthorPark, BJ-
dc.contributor.nonIdAuthorByun, KY-
dc.contributor.nonIdAuthorPaik, KW-
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ME-Conference Papers(학술회의논문)
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