DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | - |
dc.contributor.author | Kim, Jaemin | - |
dc.contributor.author | Shim, Jongjoo | - |
dc.contributor.author | Pak, JunSo | - |
dc.date.accessioned | 2013-03-27T06:53:39Z | - |
dc.date.available | 2013-03-27T06:53:39Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008 | - |
dc.identifier.citation | IEEE Electrical Design of Advanced Packaging and Systems Symposium, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/160126 | - |
dc.language | ENG | - |
dc.title | A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE Electrical Design of Advanced Packaging and Systems Symposium | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Jaemin | - |
dc.contributor.nonIdAuthor | Shim, Jongjoo | - |
dc.contributor.nonIdAuthor | Pak, JunSo | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.