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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Preparation of Microporous Copper Foam with 3-Dimensionally Interconnected Pores by Electrodeposition

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dc.contributor.authorKwon, Hyuk-Sang-
dc.contributor.authorKim, Jeong Han-
dc.contributor.authorKim, Ryoung Hee-
dc.date.accessioned2013-03-27T05:23:46Z-
dc.date.available2013-03-27T05:23:46Z-
dc.date.created2012-02-06-
dc.date.issued2008-
dc.identifier.citation214th ECS Meeting, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/159507-
dc.languageENG-
dc.publisherECS-
dc.titlePreparation of Microporous Copper Foam with 3-Dimensionally Interconnected Pores by Electrodeposition-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname214th ECS Meeting-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKwon, Hyuk-Sang-
dc.contributor.nonIdAuthorKim, Jeong Han-
dc.contributor.nonIdAuthorKim, Ryoung Hee-
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MS-Conference Papers(학술회의논문)
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