DSpace at KOASAS: Effects of Alloy Composition (Ag, Cu, Ni, Zn) and Cooling Rate on Microstructure and Microhardness of Sn-based Solders

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Alloy Composition (Ag, Cu, Ni, Zn) and Cooling Rate on Microstructure and Microhardness of Sn-based Solders

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Lee, Hyuck Mo researcher

Issue Date: 2008-04-25

Language: KOR

Citation: Korean Journal of Metal and Materials

URI: http://hdl.handle.net/10203/159345

Appears in Collection: MS-Conference Papers(학술회의논문)

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Effects of Alloy Composition (Ag, Cu, Ni, Zn) and Cooling Rate on Microstructure and Microhardness of Sn-based Solders

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